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Hot Chuck - List of Manufacturers, Suppliers, Companies and Products

Hot Chuck Product List

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Heating Process Wafer Hot Chuck PH070

Supports a maximum temperature of 300℃! Hot plate for small wafers and glass substrates.

The Heating Process Wafer Hot Chuck PH070 is a hot plate designed for small wafers and glass substrates. It uniformly heats extremely thin workpieces such as wafers and glass substrates. The workpieces are fixed in place by vacuum suction, which prevents stress from being applied to them. The plate is made of aluminum alloy, treated with black anodizing, features guide markings through laser marking, and allows for precise temperature control with an MSA digital temperature controller. For more details, please contact us or refer to the catalog.

  • Other physicochemical equipment
  • Heating device

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Heating Process Wafer Hot Chuck PH050

Supports a maximum temperature of 300℃! Hot plate for small wafers and glass substrates.

The heating process wafer hot chuck PH050 is a hot plate designed for small wafers and glass substrates. It uniformly heats extremely thin workpieces such as wafers and glass substrates. The workpieces are fixed in place by vacuum suction, which prevents stress from being applied to them. The plate is made of aluminum alloy, treated with black anodizing, features guide markings through laser marking, and allows for precise temperature control with an MSA digital temperature controller. For more details, please contact us or refer to the catalog.

  • Other physicochemical equipment
  • Heating device

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Waterproof sintered body hot chuck "PA3020-WPF type"

Ideal for heating processes that require environmental resistance! Customizable in size, cover structure, and temperature.

The "PA3020-WPF type" is a hot plate that can withstand a maximum temperature of 300°C and features a waterproof structure in the wiring section, making it highly resistant to environmental conditions. It is a hot chuck with a waterproof structure and a sintered body adsorption structure. The adsorption section is compatible not only with sintered bodies but also with hot chucks using a laminated wire mesh structure. We offer OEM support for embedded type plates in devices. *If you provide specific environmental conditions, we can also accommodate custom requests! ● For more details, please download the catalog or contact us.

  • others

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Waterproof ceramic sintered hot chuck "PA2012-WPFC"

The suction part is made of ceramic sintered material, allowing for precise heating of film-shaped workpieces.

The waterproof ceramic sintered hot chuck "PA2012-WPFC type" is ideal for the heating process of film-shaped samples. It performs film chucking at high temperatures due to its fine sintered body. Customization is available for size, cover structure, and temperature. We can support integration into your heating process and provide OEM services for equipment manufacturers. 【Features】 ○ Supports a maximum temperature of 200°C ○ The wiring part has a waterproof structure, offering excellent environmental resistance ○ Waterproof structure + ceramic sintered body adsorption structure hot chuck ○ The adsorption part is made of ceramic sintered body, allowing precise heating of film-shaped workpieces ○ OEM support available for embedded plate types in equipment For more details, please contact us or download the catalog.

  • Other processing machines

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Wafer Hot Chuck "PH-201C"

By replacing the top plate, it is possible to accommodate various workpieces.

The Wafer Hot Chuck "PH-201C" is compact and uniformly heats extremely thin workpieces such as wafers and glass substrates. The workpieces are fixed in place by vacuum suction, eliminating stress caused by fixation. Customization is available for size, suction patterns, and temperature. We can accommodate integration into your testing systems and provide OEM support for equipment manufacturers. 【Features】 ○ Supports a maximum temperature of 400°C ○ Top plate structure allows for compatibility with multiple types of workpieces through plate replacement ○ Precise temperature control is possible with the MSA digital temperature controller ○ A wide range of options available, including pressure gauges and vacuum switching valves ○ OEM support For more details, please contact us or download the catalog.

  • Other processing machines

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Wafer Hot Chuck PH101

Small wafer chuck, high precision control!! From room temperature to -200℃!

In the heating process of semiconductor wafers, we will match the interface to the equipment you have as various evaluation tables.

  • Other heaters
  • Heating device

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Wafer Hot Chuck PH-201 with XY Stage Mounted Type

Customizable in size, adsorption pattern, and temperature!

We uniformly heat extremely thin workpieces such as wafers and glass substrates. The maximum temperature that can be achieved is 300°C. The workpieces are fixed by vacuum suction, so no stress is applied to them during fixation. By combining with a manual simple XY stage, you can build an inspection station on a low budget. Precise temperature control is also possible with the MSA digital temperature controller. OEM support is also available. ● For more details, please download the catalog or contact us.

  • others

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Wafer Hot Chuck (Heating/Cooling) PJ-050 Type

The chucking (adsorption) pattern is customizable to fit the workpiece!

The "PJ-050 model" is a hot chuck for temperature testing of electronic devices and wafers, capable of handling temperatures from low to high. The temperature range is from -10 to +150°C. It can be added to existing evaluation and testing equipment, making it ideal for small quantities and research and development. It uses a heater as the heating source and a Peltier (air-cooled) as the cooling source, supporting high-speed temperature profile processes. It operates on an AC100V power supply, allowing for both cooling and heating. The temperature controller is a dedicated type that supports both cooling and heating with a single unit. For more details, please download the catalog or contact us.

  • others

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Wafer Hot Chuck (Heating/Cooling) "PJ-101 Type"

Supports a wide range from low to high temperatures! Ideal for temperature testing of electronic devices and wafers.

The "PJ-101 model" is a wafer hot chuck (heating and cooling) that can be added to existing evaluation and testing equipment, making it ideal for small quantities and research and development. It uses a heater as the heating source and a Peltier (air-cooled) as the cooling source, supporting high-speed temperature profile processes. It operates on an AC100V power supply, allowing for both cooling and heating. The temperature controller is a dedicated type that can handle both cooling and heating with a single unit. The chucking (suction) pattern can also be customized to match the workpiece. ● For more details, please download the catalog or contact us.

  • others

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Waterproof Metal Mesh Laminated Hot Chuck "PA3020-WPFC Type"

Ideal for heating processes that require environmental resistance! Customizable in size, cover structure, and temperature.

The "PA3020-WPFC model" is a hot plate that can withstand a maximum temperature of 300°C and features a waterproof structure in the wiring section, making it excellent in environmental resistance. It is a hot chuck with a waterproof structure and a sintered body adsorption structure. The adsorption section can also accommodate hot chucks with a laminated wire mesh structure. We offer OEM support for embedded type plates in devices. *If you provide specific environmental conditions, we can accommodate custom requests. ● For more details, please download the catalog or contact us.

  • Heating device

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Wafer Hot Chuck "PH-101T"

Integration into your company's testing system, OEM products for equipment manufacturers!

The "PH-101T" is a compact wafer hot chuck that can uniformly heat ultra-thin workpieces such as wafers and glass substrates, with a maximum temperature of 300°C. Its top plate structure allows for compatibility with several types of workpieces through plate replacement. The workpieces are fixed by vacuum suction, which does not impose stress on them. Additionally, precise temperature control is possible with the MSA digital temperature controller. Customization is available for size, suction patterns, and temperature. We also offer custom solutions for the method of fixing to the hot chuck stage, so please feel free to consult us. ● For more details, please download the catalog or contact us.

  • Heating device

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Wafer Hot Chuck "PH-101TIN"

Integration into your company's testing system, OEM products for equipment manufacturers!

The "PH-101TIN" is a compact wafer hot chuck that can uniformly heat ultra-thin workpieces such as wafers and glass substrates, with a maximum temperature of 300°C. Its top plate structure allows for compatibility with various types of workpieces through plate replacement. The workpieces are fixed by vacuum suction, which does not impose stress on them. Additionally, precise temperature control is possible with the MSA digital temperature controller. Customization is available for size, suction patterns, and temperature. We also offer custom solutions for how to fix the hot chuck to the stage, so please feel free to consult us. ● For more details, please download the catalog or contact us.

  • Heating device

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Waterproof ceramic sintered hot chuck "PA2020-WPFC"

For heating processes that require environmental resistance! Customizable in size, cover structure, and temperature.

The waterproof ceramic sintered hot chuck "PA2020-WPFC" features a waterproof structure and a ceramic sintered body adsorption structure. With its waterproof wiring, it is a hot plate with excellent environmental resistance. If you provide specific environmental conditions, we can accommodate custom requests. 【Features】 ○ Maximum temperature: 200°C compatible ○ The adsorption part can also support hot chucks with a laminated wire mesh structure in addition to the ceramic sintered body ○ OEM support for embedded type plates in devices is available For more details, please contact us or download the catalog.

  • Other semiconductor manufacturing equipment
  • Heating device

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